View UAA2068_61786.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

INTEGRATED CIRCUITS
DATA SHEET
UAA2068G Transmit chain and synthesizer with integrated VCO for DECT
Product specification Supersedes data of 1998 Jan 07 File under Integrated Circuits, IC17 1998 Nov 19
Philips Semiconductors
Product specification
Transmit chain and synthesizer with integrated VCO for DECT
FEATURES * Economical integrated solution for frequency generation in DECT cordless telephones * Integrated low phase noise 950 MHz VCO with frequency doubler * Local Oscillator (LO) drive (-14 dBm) for RF mixer circuit * Dedicated DECT PLL synthesizer * 3-line serial interface bus * 3 dBm output preamplifier with an integrated switch * Low current consumption from 3 V supply * Compatible with Philips Semiconductors ABC baseband chip (PCD509x series). APPLICATIONS * 1880 to 1920 MHz DECT cordless telephones. GENERAL DESCRIPTION The UAA2068G BiCMOS device integrates a 950 MHz VCO, a frequency doubler, main and reference dividers and a phase comparator, to implement a phase-locked loop for DECT channel frequencies. The 1.9 GHz signal is buffered and switched, in TX mode, to drive the transmit power amplifier (CGY20xx series) or, in RX mode, to be used as an LO signal for the receiver mixer IC (UAA2078). The synthesizer's main divider is driven by the frequency doubler output in the range from 1880 to 1920 MHz and programmed via a 3-wire serial bus. ORDERING INFORMATION PACKAGE TYPE NUMBER NAME UAA2068G LQFP32 DESCRIPTION
UAA2068G
The reference divider ratio is fixed at 8. Outputs of the main and reference dividers drive a phase comparator where a charge pump produces phase error current pulses for integration in an external loop filter. Only a passive loop filter is necessary. The charge-pump current (phase comparator gain) is set by an external resistor at pin RSET. The VCO is powered from an internally regulated voltage source and includes internal varicap diodes. Its tuning range is wider than the required band to allow for production spreads. In a TDMA system such as DECT, the VCO and the synthesizer are switched on one slot before the required one to lock the VCO to the required channel frequency. Just before the required slot, the synthesizer is switched off, allowing open-loop modulation of the VCO during transmission. When opening the loop, the frequency pulling (due to switching off the synthesizer) can be maintained within the DECT specification. The device is designed to operate from 3 NiCd cells in pocket phones, with low current and nominal 3.6 V supplies. Separate power and ground pins are provided to the different parts of the circuit. The ground leads should be short-circuited externally to prevent large currents flowing across the die and thus causing damage. All supply pins (VCC) must also be at the same potential, except VCC(CP) which can be equal to or greater than the other supply pins (e.g. VCC = 3 V and VCC(CP) = 5 V for wider VCO control voltage range).
VERSION SOT401-1
plastic low profile quad flat package; 32 leads; body 5 x 5 x 1.4 mm
1998 Nov 19
2
Philips Semiconductors
Product specification
Transmit chain and synthesizer with integrated VCO for DECT
UAA2068G
QUICK REFERENCE DATA VCC = 3.6 V; VCC(CP) = 3.6 V; Tamb = 25 C; unless otherwise specified. Characteristics for which only a typical value is given are not tested. SYMBOL VCC VCC(CP) ICC(SYA) + ICC(SYD) ICC(VCO) + ICC(BUF) ICC(DBL) ICC(AMP) ICC(pd) fo(RF) fxtal fPC Tamb PARAMETER general supply voltage charge-pump supply voltage synthesizer supply current VCO and buffer parts supply current doubler supply current TX preamplifier supply current total supply current in power-down mode RF output frequency crystal reference input frequency phase comparator frequency operating ambient temperature VCC(CP) VCC S_EN = 1 VCO_ON = 1 in RX mode in TX mode in RX mode in TX mode CONDITIONS MIN. 3.0 3.0 - - - - - - - 1880 - - -10 TYP. 3.6 3.6 9.5 9.5 14.4 10 0 24 5 - 13.824 1728 - MAX. 5.2 5.2 14 14 19 14 50 32 50 1920 - - +60 UNIT V V mA mA mA mA A mA A MHz MHz kHz C
1998 Nov 19
3
Philips Semiconductors
Product specification
Transmit chain and synthesizer with integrated VCO for DECT
BLOCK DIAGRAM
UAA2068G
handbook, full pagewidth
VCC(AMP) 26 29 28 27 VCC(DBL) PREAMP 30
T_EN 15
VCC(DBL) 11
VCC(BUF) 16
VCC(VCO)
L
L
VREG VCOB VCOA 17 24 21 20 23 VTUNE VMOD
R_OFF TXA TXB AMPGND
RF SWITCH
DOUBLER
BUFFER
VCO
18
25 LOA LOB VCC(SYD) VCC(SYA) 12 13 2 5 MAIN DIVIDER 3-LINE BUS REFERENCE DIVIDER 32 1 31 4 3 6 SYAGND RSET 10 7 CPGND RSET
MGK383
LO BUFFER
UAA2068G
VCO_ON VCGND VCOGND DBLGND VCC(CP)
22 19 14 9
PHASE COMPARATOR
CHARGE PUMP
8
CP
S_EN DATA CLK XTAL SYDGND
Fig.1 Block diagram.
1998 Nov 19
4
Philips Semiconductors
Product specification
Transmit chain and synthesizer with integrated VCO for DECT
PINNING SYMBOL DATA VCC(SYD) SYDGND XTAL VCC(SYA) SYAGND CPGND CP VCC(CP) RSET VCC(DBL) LOA LOB DBLGND T_EN VCC(BUF) VCC(VCO) VMOD VCOGND VCOA VCOB VCGND VTUNE VREG VCO_ON R_OFF AMPGND TXB TXA VCC(AMP) CLK S_EN Notes 1. Pins 19 and 22 are internally short-circuited. 2. Use with S_PWR on ABC baseband chip. 3. Use with R_PWR on ABC baseband chip. PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 3-wire programming bus data input synthesizer CMOS divider positive supply voltage synthesizer CMOS divider ground reference frequency input synthesizer prescaler positive supply voltage synthesizer prescaler ground charge-pump ground charge-pump output signal charge-pump positive supply voltage charge-pump current setting input doubler positive supply voltage local oscillator output A local oscillator output B doubler ground transmit enable signal input VCO isolation buffer positive supply voltage VCO positive supply voltage transmit modulation input VCO ground; note 1 VCO inductor connection A VCO inductor connection B internal varicap ground; note 1 VCO tuning input VCO regulator output VCO power on control input; note 2 power on control for RX LO buffer/TX preamplifier; note 3 transmit amplifier ground transmit amplifier output B transmit amplifier output A transmit amplifier positive supply voltage 3-wire programming bus clock input synthesizer enable signal input DESCRIPTION
UAA2068G
1998 Nov 19
5
Philips Semiconductors
Product specification
Transmit chain and synthesizer with integrated VCO for DECT
UAA2068G
27 AMPGND
25 VCO_ON
handbook, full pagewidth
30 VCC(AMP)
26 R_OFF
32 S_EN
31 CLK
28 TXB
29 TXA
DATA VCC(SYD) SYDGND XTAL VCC(SYA) SYAGND CPGND CP
1 2 3 4
24 VREG 23 VTUNE 22 VCGND 21 VCOB
UAA2068G
5 6 7 8 20 VCOA 19 VCOGND 18 VMOD 17 VCC(VCO) VCC(DBL) 11 RSET 10 LOA 12 LOB 13 DBLGND 14 T_EN 15 VCC(BUF) 16
9
VCC(CP)
MGK382
Fig.2 Pin configuration.
FUNCTIONAL DESCRIPTION Transmit chain VCO, BUFFER AND FREQUENCY DOUBLER The VCO operates at a nominal centre frequency of 950 MHz. It is fully integrated apart from two inductors which complete the resonator network. This VCO operates from an on-chip regulated power supply (VREG), which minimizes frequency disturbances due to variations in supply voltage. The buffered VCO signal is fed into a frequency doubler. The large difference between the transmitted and VCO frequencies reduces transmitter-oscillator coupling problems. The output of the doubler is used to drive the synthesizer main divider and can also be switched to either the TX preamplifier or the RX LO output buffer. The high isolation obtained from the VCO buffer and the frequency doubler ensures very small frequency changes when turning on the TX preamplifier or the RX LO output buffer. In TX mode, the oscillator can be directly modulated with GMSK filtered data at pin VMOD.
RF SWITCH The RF switch passes the doubled VCO signal to either the TX preamplifier (when T_EN is HIGH) or to the RX LO buffer (when T_EN is LOW). In TX mode, the difference in the RF power levels, observed at the TX output when T_EN is switched from LOW-to-HIGH, is typically 40 dB. TX PREAMPLIFIER The TX preamplifier amplifies the RF signal up to a level of 3 dBm which is suitable for use with Philips Semiconductors DECT power amplifiers such as the CGY20xx series. It is powered-up when both R_OFF and VCO_ON are HIGH. RX LO BUFFER The RX LO buffer outputs the frequency doubled VCO signal at a level of -14 dBm. This signal can then be used as the local oscillator drive for the receive mixers of devices such as the UAA2078. The buffer is powered-up when R_OFF is LOW and VCO_ON is HIGH.
1998 Nov 19
6
Philips Semiconductors
Product specification
Transmit chain and synthesizer with integrated VCO for DECT
Synthesizer MAIN DIVIDER The main divider is clocked by the RF signal from the internal frequency doubler. The divider operates at frequencies from 1880 to 1920 MHz. It consists of a bipolar prescaler followed by a CMOS counter. Any main divider ratio from 1024 to 1151 inclusive can be programmed. REFERENCE DIVIDER The reference divider is clocked by the signal at pin XTAL. The circuit operates with levels from 50 to 500 mV (RMS) at a frequency of 13.824 MHz, with a fixed divider ratio of 8. PHASE COMPARATOR The phase comparator is driven by the output of the main and reference dividers. It produces current pulses at pin CP. The pulse duration is equal to the difference in time of arrival of the edges from the two dividers. If the main divider edge arrives first, CP sinks current. If the reference divider edge arrives first, CP sources current. The DC value of the charge-pump current is nominally ten times the current drawn by the external resistor connected to pin RSET. Additional circuitry is included to ensure that the gain of the phase detector remains linear even for small phase errors. The charge pump has a separate supply, VCC(CP), which helps to reduce the interference on the charge-pump output from other parts of the circuit. VCC(CP) can be higher than the other supply voltages if a wider range on the VCO input is required. The VCC(CP) voltage must not be less than that on other VCC pins. Serial programming bus A simple 3-line unidirectional serial bus is used to program the circuit. These 3 lines are data (DATA), clock (CLK) and enable (S_EN). The data sent to the device is loaded in bursts framed by S_EN. Programming clock edges and their appropriate data bits are ignored until S_EN goes active LOW. The programmed information is read directly by the main divider when S_EN returns HIGH. During synthesizer operation, S_EN should be kept HIGH. In normal operating mode, only the last 8 bits serially clocked into the device are retained within the register. Additional leading bits are ignored, and no check is made on the number of clock pulses. The data format is shown in Table 2. The first bit entered is b7, the last bit is b0.
UAA2068G
For the divider ratio, the first bit (b6) entered is the most significant (MSB). S_EN must be LOW to capture new programming data. S_EN must be HIGH to switch on the synthesizer. Operating modes The synthesizer is on when the input signal S_EN is HIGH, and off when S_EN is LOW. When turned on, the dividers and phase detector are synchronized to avoid a random initial phase error. When turned off, the phase detector is synchronized with the dividers to avoid interrupting a charge-pump pulse. The VCO is on when the input signal VCO_ON is HIGH. The polarity of VCO_ON is chosen for compatibility with output S_PWR at the ABC chip. When turned on, it needs some time (typically 30 s) to reach its steady state. The TX preamplifier is on when both R_OFF and VCO_ON are HIGH. The polarity of R_OFF is chosen for compatibility with output R_PWR at the ABC chip. When turned on, it needs some time (typically 10 s) to reach its steady state. In transmit mode, the timing of the R_OFF LOW-to-HIGH transition can be chosen such that the TX preamplifier is turned on while the synthesizer loop remains closed thus avoiding frequency pulling of the VCO. In the receive mode, depending on the exact timing of R_OFF compared to VCO_ON, the TX preamplifier can be switched on at the beginning of the previous slot, but is switched off when the R_OFF goes LOW; this occurs when the synthesizer loop is closed. The LO output amplifier is turned on when R_OFF is LOW and VCO_ON is HIGH. The UAA2068G has a very low current consumption in power-down mode.
1998 Nov 19
7
Philips Semiconductors
Product specification
Transmit chain and synthesizer with integrated VCO for DECT
Table 1 Mode control; note 1 BLOCK STATUS VCO, buffer, doubler, RF switch, TX preamplifier and LO buffer powered-down VCO, buffer, doubler, RF switch and TX preamplifier powered-up LO buffer powered-down Nominal RF signal at TX output VCO, buffer, doubler, RF switch and TX preamplifier powered-up LO buffer powered-down No RF signal output VCO, buffer, doubler, RF switch and LO buffer powered-up TX preamplifier powered-down Nominal RF signal at LO buffer output VCO, buffer, doubler, RF switch and LO buffer powered-up TX preamplifier powered-down No RF signal output To power-down PLL blocks; notes 2 and 3 To power-up PLL blocks; notes 2 and 3 All blocks in power-down state; notes 2 and 3 New PLL division ratio is loaded and the PLL blocks are powered-up on the rising edge of S_EN; note 3 Notes 1. X = don't care. 2. PLL blocks are the main divider, reference divider, phase detector and charge pump. 3. A reference signal is needed on pin XTAL for correct operation. 1 1 0 1 X X X X 1 0 1 0 1 1 VCO_ON 0 1 R_OFF X 1
UAA2068G
T_EN X 1
S_EN X X
0
X
0
X
1
X
X X X X
0 1 0 0 to 1
1998 Nov 19
8
Philips Semiconductors
Product specification
Transmit chain and synthesizer with integrated VCO for DECT
Table 2 FIRST IN Bit allocation; notes 1 and 2 REGISTER BIT ALLOCATION DATA FIELD b15(3) X Notes 1. X = don't care. 2. In normal operation, only 8 bits are programmed into the register. 3. For normal operation, b15 to b8 do not need to be programmed. 4. The validation bit (b7) must be programmed with zero for normal operation. 5. Bit b6 is the MSB of the main divider coefficient. 6. The main divider ratio is equal to 1024 plus the programmed value (see Table 3). Table 3 b6 Main divider programming b5 b4 b3 b2 b1 b0 MAIN DIVIDER RATIO 1024 + n 0 1 1 0 1089 1098 b14(3) X b13(3) X b12(3) X b11(3) X b10(3) X b9(3) X b8(3) X b7(4) 0 b6(5) b5 b4 b3
UAA2068G
LAST IN
b2
b1
b0
main divider
programming(6)
SYNTHESIZED FREQUENCY (MHz) 1.728 x (1024 + n) 1881.792 1897.344
Binary equivalent of n 1 1 0 0 0 0 0 1 0 0
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VCC VCC(CP) VCC(CP) - VCC GND Ptot Tstg Tamb Tj Note 1. Pins short-circuited internally must be short-circuited externally. HANDLING Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling MOS devices. supply voltage charge-pump supply voltage difference in voltage between VCC(CP) and VCC difference in ground supply voltage applied between all ground pins total power dissipation storage temperature operating ambient temperature junction temperature note 1 PARAMETER CONDITIONS MIN. -0.3 -0.3 -0.3 - - -55 -10 - MAX. +5.5 +5.5 +5.5 0.3 275 +125 +60 150 UNIT V V V V mW C C C
1998 Nov 19
9
Philips Semiconductors
Product specification
Transmit chain and synthesizer with integrated VCO for DECT
THERMAL CHARACTERISTICS SYMBOL Rth(j-a) PARAMETER thermal resistance from junction to ambient CONDITIONS in free air
UAA2068G
VALUE 100
UNIT K/W
CHARACTERISTICS VCC = 3.6 V; VCC(CP) = 3.6 V; Tamb = 25 C; unless otherwise specified. Characteristics for which only a typical value is given are not tested. SYMBOL Supplies VCC VCC(CP) ICC(SYA) + ICC(SYD) ICC(VCO) + ICC(BUF) ICC(DBL) ICC(AMP) ICC(pd) supply voltage charge-pump supply voltage synthesizer supply current VCO and buffer parts supply current doubler supply current TX preamplifier supply current total supply current in power-down mode VCC(CP) VCC S_EN = 1 VCO_ON = 1 in RX mode in TX mode in RX mode in TX mode 3 3 - - - - - - - 3.6 3.6 9.5 9.5 14.4 10 0 24 5 5.2 5.2 14 14 19 14 50 32 50 V V mA mA mA mA A mA A PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Synthesizer main divider fRF Rm fxtal Vxtal(rms) Rref Ri Ci Phase detector fPC Io(cp) Io(cp)(err) Imatch IL(cp) phase comparator frequency VCP = 12VCC; RSET = 8.2 k VCP =
1 2VCC
RF frequency main divider ratio
1880 1024 - 50 - fxtal = 13.824 MHz - -
- -
1920 1151 - 500 - - -
MHz
Synthesizer reference divider input crystal reference input frequency sinusoidal input signal level (RMS value) reference division ratio input resistance (real part of the input impedance) input capacitance (imaginary part of the input impedance) 13.824 - 8 4.5 2.5 MHz mV
k pF
- - -25 - -1
1728
- - +25 - +1
kHz
Charge-pump output charge-pump output current 1.5 - 5 0 mA % % nA
charge-pump output current error note 1 sink-to-source current matching charge-pump-off leakage current VCP = 12VCC
1998 Nov 19
10
Philips Semiconductors
Product specification
Transmit chain and synthesizer with integrated VCO for DECT
SYMBOL PARAMETER CONDITIONS MIN. TYP.
UAA2068G
MAX.
UNIT
Charge-pump current setting resistor input; pin RSET RSET VSET VCO fVCO GVCO GMOD Switch part FTLOTXoff isolation between LO and TX outputs when TX preamplifier is off (RX mode) isolation due to the switch when TX preamplifier is on (TX mode) f = 1890 MHz; note 2 - -50 - dB oscillator frequency tuning input VCO gain modulation input VCO gain over full temperature range; note 2 940 - - - 45 1 960 - - MHz MHz/V MHz/V external resistor connected between pin RSET and ground regulated voltage at pin RSET 5.6 - - 1.2 12 - k V
FTLOTXon
f = 1890 MHz; note 2
-
-40
-
dB
TX preamplifier and LO buffer parts Po(TX) fo(TX) Ro(TX) TX preamplifier output power output frequency on TX preamplifier or LO buffer TX preamplifier output resistance (real part of the parallel output impedance) TX preamplifier output capacitance (imaginary part of the parallel output impedance) VCO frequency feedthrough at the TX output balanced over full temperature range; note 2 0 1880 - 3 - 150 7 1920 - dBm MHz
Co(TX)
balanced
-
0.5
-
pF
FTVCOTX CNR25 CNR4686 fo(offset)
referenced to the fo(TX) level; note 2
-
-41 -75 -135 -
-36 - -132 15
dBc
dBc/Hz dBc/Hz
carrier-to-noise ratio at TX output carrier offset f = 25 kHz - carrier-to-noise ratio at TX output carrier offset f = 4686 kHz total frequency shift due to 200 mV VCC change disabling the synthesizer measured 20 s after disabling the synthesizer note 2 note 2 balanced - - - note 2 - -
kHz
fo(drift) Po(LO) Ro(LO)
frequency drift during a slot LO preamplifier output power LO preamplifier output resistance (real part of the parallel output impedance) LO preamplifier output capacitance (imaginary part of the parallel output impedance)
1 -14 120
10 - -
kHz dBm
Co(LO)
balanced
-
0
-
pF
1998 Nov 19
11
Philips Semiconductors
Product specification
Transmit chain and synthesizer with integrated VCO for DECT
SYMBOL PARAMETER CONDITIONS MIN. - - - 2 TYP.
UAA2068G
MAX.
UNIT
Interface logic input signal levels; pins DATA, CLK, S_EN, T_EN, R_OFF and VCO_ON VIH VIL Ibias Ci Notes 1. Condition: 0.5 < VCP < (VCC(CP) - 0.5). 2. Measured and guaranteed only on the Philips evaluation board, including PCB and balun filter. 3. VIH should never exceed 5.2 V. SERIAL BUS TIMING CHARACTERISTICS VCC = 3.6 V; Tamb = 25 C; unless otherwise specified. SYMBOL Serial programming clock; CLK tr tf Tcy tSTART tEND tW tSU;S_EN tSU;DAT tHD;DAT input rise time input fall time clock period - - 100 10 10 - - - - - - - 40 40 - - - - - - - ns ns ns PARAMETER MIN. TYP. MAX. UNIT HIGH-level input voltage LOW-level input voltage input bias current input capacitance logic 1 or logic 0 note 3 2.2 -0.3 -5 - VCC + 0.3 +0.5 +5 - V V A pF
Enable programming; S_EN delay to rising clock edge delay from last falling clock edge minimum inactive pulse width enable set-up time to next clock edge 40 -20 4000 20 ns ns ns ns
Register serial input data; DATA input data to clock set-up time input data to clock hold time 20 20 ns ns
tSU;DAT handbook, full pagewidth
tHD;DAT
Tcy
tf
tr
tEND
tSU;S_EN
CLK
DATA
MSB
LSB
S_EN tSTART
MBK095
tW
Fig.3 Serial bus timing diagram.
1998 Nov 19
12
Philips Semiconductors
Product specification
Transmit chain and synthesizer with integrated VCO for DECT
TIMING CHARACTERISTICS
UAA2068G
handbook, full pagewidth
previous slot slot time In TX mode DATA
active slot
CLK
S_EN VCO_ON = S_PWR (1) R_OFF = R_PWR (1) T_EN
In RX mode DATA
CLK
S_EN VCO_ON = S_PWR (1) R_OFF = R_PWR (1) T_EN
MGK384
(1) On ABC baseband chip.
Fig.4 Application bus timing diagram.
1998 Nov 19
13
Philips Semiconductors
Product specification
Transmit chain and synthesizer with integrated VCO for DECT
APPLICATION INFORMATION
UAA2068G
handbook, full pagewidth
TXOUT
1 pF VCC 6.8 nH 6.8 nH 22 pF 8.2 pF 8.2 pF
8.2 nH 10 pF
1 pF 8.2 nH 10 pF
1.8 nH 22 pF 3.9 pF VCC(AMP) AMPGND 1 k 8.2 pF VCO_ON 1 k 8.2 pF VREG VTUNE VCGND VCOB VCOA VCOGND VMOD VCC(VCO) 8.2 pF VCC VCC from ABC chip L2 6.8 nH 8.2 pF L1 6.8 nH 82 nF from ABC chip
CLK
1 k 1 k 8.2 pF from ABC chip VCC 8.2 pF DATA 1 2 3 4
32
31
30
TXA
29
TXB
8.2 pF
S_EN
1 k
28
27
R_OFF 26
25 24 23 22 21
VCC(SYD) SYDGND XTAL
VCC 100 nF
VCC(SYA) SYAGND CPGND CP
UAA2068G
5 6 7 8 9 VCC(CP) 10 RSET 11 VCC(DBL) 12 LOA 13 LOB 14 DBLGND 15 T_EN 16 VCC(BUF) 20 19 18 17
8.2 pF
RSET 8.2 k 3.9 k loop filter 560 pF 8.2 nF NPO 1.5 k
VCC
8.2 pF
8.2 pF
120 pF
8.2 pF to receiver
8.2 pF
1 k from ABC chip 8.2 pF
MGK385
L1 and L2: order of magnitude. Values depend on board layout.
Fig.5 Typical application diagram.
1998 Nov 19
14
Philips Semiconductors
Product specification
Transmit chain and synthesizer with integrated VCO for DECT
PACKAGE OUTLINE LQFP32: plastic low profile quad flat package; 32 leads; body 5 x 5 x 1.4 mm
UAA2068G
SOT401-1
c y X
24 25
17 16 ZE
A
e E HE wM bp 32 1 8 9 L detail X Lp A A2 A1 pin 1 index (A 3)
e bp D HD
ZD wM B
vM A
vM B
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.60 A1 0.15 0.05 A2 1.5 1.3 A3 0.25 bp 0.27 0.17 c 0.18 0.12 D (1) 5.1 4.9 E (1) 5.1 4.9 e 0.5 HD 7.15 6.85 HE 7.15 6.85 L 1.0 Lp 0.75 0.45 v 0.2 w 0.12 y 0.1 Z D (1) Z E (1) 0.95 0.55 0.95 0.55 7 0o
o
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT401-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-12-19 97-08-04
1998 Nov 19
15
Philips Semiconductors
Product specification
Transmit chain and synthesizer with integrated VCO for DECT
SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed-circuit boards with high population densities. In these situations reflow soldering is often used. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 230 C. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results:
UAA2068G
* Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1998 Nov 19
16
Philips Semiconductors
Product specification
Transmit chain and synthesizer with integrated VCO for DECT
Suitability of surface mount IC packages for wave and reflow soldering methods SOLDERING METHOD PACKAGE WAVE BGA, SQFP HLQFP, HSQFP, HSOP, SMS PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes not suitable not suitable(2) suitable not recommended(3)(4) not recommended(5) suitable suitable suitable suitable suitable
UAA2068G
REFLOW(1)
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
1998 Nov 19
17
Philips Semiconductors
Product specification
Transmit chain and synthesizer with integrated VCO for DECT
NOTES
UAA2068G
1998 Nov 19
18
Philips Semiconductors
Product specification
Transmit chain and synthesizer with integrated VCO for DECT
NOTES
UAA2068G
1998 Nov 19
19
Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 160 1010, Fax. +43 160 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 689 211, Fax. +359 2 689 102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. +45 32 88 2636, Fax. +45 31 57 0044 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615800, Fax. +358 9 61580920 France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex, Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 23 53 60, Fax. +49 40 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS, Tel. +30 1 4894 339/239, Fax. +30 1 4814 240 Hungary: see Austria India: Philips INDIA Ltd, Band Box Building, 2nd floor, 254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025, Tel. +91 22 493 8541, Fax. +91 22 493 0966 Indonesia: PT Philips Development Corporation, Semiconductors Division, Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510, Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494 South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SAO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263 Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2865, Fax. +886 2 2134 2874 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 625 344, Fax.+381 11 635 777 Internet: http://www.semiconductors.philips.com
For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1998
SCA60
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
435102/750/03/pp20
Date of release: 1998 Nov 19
Document order number:
9397 750 04258

▲Up To Search▲

Price & Availability of UAA2068

	To Download UAA2068 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .